Domestically produced single-wafer cleaning machines are on the rise, supporting the independent development of the semiconductor industry chain.

The Rise of Domestic Single-Wafer Cleaning Machines: Supporting the Independent Development of the Semiconductor Industry Chain

I. The Context of Independent Development in Semiconductor Equipment

In recent years, the global semiconductor industry landscape has been undergoing profound changes. From chip design and wafer manufacturing to packaging and testing, countries are actively pursuing localization and independent development. Cleaning equipment, as an indispensable key component in wafer manufacturing, directly determines the yield and quality of chip production.

In the wafer manufacturing process, after each photolithography, etching, deposition, and polishing step, the wafer surface needs to be cleaned to a high degree of cleanliness to remove particles, metal ions, and organic residues. Previously, these core devices were almost entirely monopolized by international manufacturers, and domestic wafer production lines were highly dependent on imported cleaning equipment.

Now, with continuous breakthroughs in domestic technology, domestically produced single-wafer cleaning machines are rapidly emerging, not only achieving stable improvements in key performance indicators but also providing solid support for the independent and controllable development of the semiconductor industry chain.

II. The Important Role of Single-Wafer Cleaning Machines in Chip Manufacturing

Wafer cleaning equipment is one of the most frequently used process equipment in semiconductor manufacturing. Cleaning steps can account for more than 30% of the total process steps in the entire wafer production process.

Single-wafer cleaning machines adopt a "single-wafer independent cleaning" mode, processing only one wafer at a time, allowing for precise control of cleaning fluid usage, spray angle, and rotation speed. Compared with traditional batch cleaning equipment, it offers higher cleanliness, lower contamination risk, and better energy efficiency.

Its main functions include:

Pre-photolithography cleaning: Removing impurities from the wafer surface to ensure uniform photoresist adhesion;

Post-etching cleaning: Removing reaction byproducts and etching residues to prevent cross-contamination;

Post-chemical mechanical polishing (CMP) cleaning: Removing polishing particles and residual liquids to maintain wafer flatness;

Final cleaning: Achieving thorough decontamination before chip packaging to ensure product yield.

The rise of domestically produced cleaning equipment means that Chinese semiconductor manufacturing companies can achieve independent equipment configuration in more critical stages, thereby effectively reducing costs and supply risks.

III. Technological Breakthroughs in Domestic Single-Wafer Cleaning Machines

Previously, domestic equipment lagged behind in terms of cleaning uniformity, precision control, and automation. In recent years, with continuous investment from domestic research institutions and equipment manufacturers, domestically produced single-wafer cleaning machines have made significant progress in several core technology areas.

High-precision rotation and positioning system

Through high-performance servo drives and precision positioning control, low-vibration operation of the wafer during rotation is achieved, improving cleaning uniformity.

Advanced fluid dynamics spraying technology

Using a multi-angle, adjustable nozzle design, the cleaning fluid forms a uniform coverage on the wafer surface, improving particle removal efficiency.

Automatic chemical liquid control and recycling system

It can accurately proportion, quantitatively spray, and recycle different chemical liquids, reducing chemical consumption and achieving green and energy-saving cleaning.

Intelligent control platform

Equipped with self-learning algorithms and process optimization systems, it automatically adjusts cleaning parameters according to different wafer types, improving the flexibility of the production line.

Non-contact drying technology

Using Marangoni drying or nitrogen gas blowing, it effectively prevents secondary contamination of the wafer surface.

These technological breakthroughs signify that the manufacturing level of domestically produced single-wafer cleaning machines is gradually approaching international advanced standards.

IV. Energy-saving and environmentally friendly concepts drive equipment upgrades

In semiconductor manufacturing, the consumption of chemicals and ultrapure water in the cleaning process has always been significant. In response to the requirements of energy saving, emission reduction, and green manufacturing, domestically produced single-wafer cleaning machines have continuously innovated in energy-saving and environmentally friendly design.

Efficient chemical liquid recycling: Through filtration, regeneration, and reuse technologies, the amount of chemical waste is significantly reduced;

Intelligent flow control system: Automatically adjusts the amount of cleaning liquid sprayed according to the wafer surface contamination, avoiding resource waste;

Low-energy heating and drying modules: Using energy-saving heating elements and airflow drying devices to reduce electricity consumption;

Waste gas and liquid treatment devices: Effectively capture harmful volatile substances and neutralize waste liquid to achieve compliant discharge.

These energy-saving designs not only help companies reduce operating costs but also comply with national green manufacturing policies, enhancing the market competitiveness of the equipment.

V. Market application and industrial support for domestically produced equipment

With the rise of the domestic wafer fabrication plant construction boom, domestically produced single-wafer cleaning machines have been applied in several well-known semiconductor companies and research institutions. Its application areas include:

8-inch and 12-inch wafer production lines;

Compound semiconductor (SiC, GaN) production;

MEMS, LED, and power device manufacturing;

Advanced packaging and testing.

In these areas, domestic equipment has demonstrated excellent stability and cleaning efficiency. Especially in third-generation semiconductor processes, domestic manufacturers have been able to develop customized solutions with stronger corrosion resistance and higher cleaning precision, tailored to the characteristics of hard materials.

At the same time, with the maturation of the upstream and downstream industrial chains, a relatively complete supply system for equipment components has been established domestically, from high-purity fluid valves and chemical liquid pipelines to control chips, all gradually achieving domestic substitution.

VI. Policy Support and Accelerated Domestic Substitution

The national government attaches great importance to the semiconductor equipment industry. In recent years, several policy documents have explicitly proposed promoting independent research and development of core equipment and supporting the localization of key equipment.

Through government special funds, tax breaks, and industry-university-research collaboration projects, domestic wafer cleaning equipment companies have grown rapidly. A number of technologically strong manufacturers have emerged in Suzhou, Shanghai, Beijing, Chengdu, and other places, forming regional equipment industry clusters.

At the same time, wafer foundries are actively purchasing domestic equipment for verification and mass production, providing valuable process feedback and market opportunities for domestic cleaning machine manufacturers. With continuous performance improvements, the market share of domestic equipment in the mid-to-high-end market is expected to further expand.

VII. Future Development Trends: Intelligence and Internationalization

The future development direction of domestic single-wafer cleaning machines will focus more on intelligence and internationalization.

Integration of Intelligent Manufacturing

Through AI algorithms, big data analysis, and IoT systems, equipment status monitoring, remote maintenance, and predictive maintenance will be realized, further improving equipment utilization.

Modularity and Flexible Production

Modular design allows for rapid switching of cleaning solutions according to different production lines, meeting the needs of multi-variety wafer manufacturing.

International Market Expansion

With improved product performance, some domestic equipment has entered emerging markets such as Southeast Asia, India, and the Middle East, providing more cost-effective options for the global semiconductor industry.

Green Cleaning Process Innovation

Adopting new cleaning technologies such as ozone water and supercritical CO₂, while maintaining cleaning effectiveness and reducing environmental impact.

These trends will drive domestic wafer cleaning equipment from "technological breakthroughs" to "global brand building," achieving a comprehensive improvement in industrial value. VIII. Conclusion

The rise of domestically produced single-wafer cleaning machines is a significant milestone in China's independent development of semiconductor equipment. It not only breaks the monopoly of foreign technology but also promotes the coordinated development of the entire industry chain.

With continuous technological innovation and the expansion of application scenarios, domestically produced cleaning equipment will continue to achieve breakthroughs in performance, energy efficiency, and intelligence, providing more competitive solutions for semiconductor manufacturing in China and globally.

In future chip production lines, domestically produced single-wafer cleaning machines will, with their stable, efficient, and energy-saving characteristics, help the semiconductor industry chain move towards a more independent, secure, and sustainable stage of development.